單片機(jī)設(shè)計外文翻譯 (2)

1、<p><b>　　一、仿真器的發(fā)展</b></p><p>　　縱觀國內(nèi)近二十年的仿真技術(shù)發(fā)展歷程，根據(jù)仿真器使用的技術(shù)來劃分，國內(nèi)仿真器的設(shè)計大約可以分成以下幾個時期：</p><p>　　(1) 70年代末期-80年代中期</p><p>　　這個時期采用的技術(shù)主要是仿真開發(fā)系統(tǒng)，現(xiàn)在看來技術(shù)含量不高，用戶要求也不高。</

2、p><p>　　(2) 80年代末期-90年代末期</p><p>　　這個時期主要使用華邦一顆帶有仿真功能的芯片制作，采用的技術(shù)叫做Bondout。采用這顆芯片能大大簡化仿真器的設(shè)計，因此國內(nèi)仿真器的水準(zhǔn)有了大的提高，基本上可以不占用用戶資源。</p><p>　　正是由于仿真性能的提高，國內(nèi)的仿真器制作在將近10年的時間內(nèi)沒有進(jìn)步，一直采用這種制作模式。雖然個別廠商

3、也嘗試過別的技術(shù)來提高仿真水準(zhǔn)，例如HOOKS技術(shù)，但是由于本身技術(shù)的限制沒有成功。相反國外的仿真器較早地使用了HOOKS技術(shù)，在初期由于HOOKS技術(shù)本身的復(fù)雜性，仿真性能和價格不如國內(nèi)采用Bondout的仿真器。</p><p>　　隨著IC技術(shù)的發(fā)展，國內(nèi)制作HOOKS技術(shù)的條件已經(jīng)成熟，但是國內(nèi)的幾家主要的生產(chǎn)廠商還陶醉于Bondout技術(shù)之中。</p><p>　　(3) 200

4、0年開始</p><p>　　2000年是中國仿真器市場變化最大的時期，其中最引人注目的變化是華邦仿真芯片W78958的停產(chǎn)。</p><p>　　華邦公司在設(shè)計W78958芯片時，其內(nèi)部的仿真功能只是為了仿真器廠商能制作仿真器以便更好的推廣W78958。但是經(jīng)過幾年的變化，W78958演變成為一顆仿真器上使用的仿真專用芯片而不是用戶使用的標(biāo)準(zhǔn)芯片，使用的范圍也僅限于國內(nèi)，一年不到2000

5、0只的用量也促使華邦公司在進(jìn)入2002年后宣布將停產(chǎn)該芯片。</p><p>　　W78958停產(chǎn)以后，國內(nèi)仿真器廠商處于一個非常尷尬的局面。由于W78958在國內(nèi)使用了將近10年，國內(nèi)的用戶群非常龐大，這些用戶將無法得到持續(xù)的支持特別是維修方面。另外，國內(nèi)圍繞在W78958上所做的技術(shù)工作也無法得到延續(xù)和提高，很多業(yè)界人士認(rèn)為仿真器行業(yè)將面臨另起爐灶或重新洗牌的局面。</p><p>　

6、　HOOKS技術(shù)無疑是仿真器廠商在失去W78958后的替代品，但是由于沒有長期跟蹤和關(guān)注，短期內(nèi)多數(shù)廠家無法將復(fù)雜的HOOKS技術(shù)應(yīng)用于成熟的產(chǎn)品中。專家們認(rèn)為仿真器廠家的整體轉(zhuǎn)型可能需要2－3年的周期，并且有相當(dāng)?shù)姆抡嫫鲝S家將會被淘汰，市場擁有量將主要集中在少數(shù)幾個仿真器廠家。</p><p>　　隨著芯片廠家越來越多、資源越來越強(qiáng)，用甲廠芯片去仿真乙廠芯片的兼容仿真模式，存在資源覆蓋不全(如附加端口、附加外部

7、中斷)、地址分布不同(如P4口)、操作方式不同(如EXTRAM、WTD)等缺點。 用專用仿真芯片或Philips芯片去仿真20多個廠家的400多種芯片，所需的仿真頭越來越多，因此有了新一代專利技術(shù)的仿真器。</p><p>　　但是新一代專利技術(shù)的仿真器卻使沒有什么經(jīng)濟(jì)能力的初學(xué)者無力購買。</p><p>　　二、單片機(jī)的發(fā)展趨勢</p><p>　　現(xiàn)在可以說單

8、片機(jī)是百花齊放，百家爭鳴的時期，世界上各大芯片制造公司都推出了自己的單片機(jī)，從8位、16位到32位，數(shù)不勝數(shù)，應(yīng)有盡有，有與主流C51系列兼容的，也有不兼容的，但它們各具特色，互成互補(bǔ)，為單片機(jī)的應(yīng)用提供廣闊的天地。 </p><p>　　縱觀單片機(jī)的發(fā)展過程，可以預(yù)示單片機(jī)的發(fā)展趨勢，大致有： </p><p>　　1.低功耗CMOS化 　　</p><p>　　

9、MCS-51系列的8031推出時的功耗達(dá)630mW，而現(xiàn)在的單片機(jī)普遍都在100mW左右，隨著對單片機(jī)功耗要求越來越低，現(xiàn)在的各個單片機(jī)制造商基本都采用了CMOS(互補(bǔ)金屬氧化物半導(dǎo)體工藝)。象80C51就采用了HMOS(即高密度金屬氧化物半導(dǎo)體工藝)和CHMOS(互補(bǔ)高密度金屬氧化物半導(dǎo)體工藝)。CMOS雖然功耗較低，但由于其物理特征決定其工作速度不夠高，而CHMOS則具備了高速和低功耗的特點，這些特征，更適合于在要求低功耗象電池供電

10、的應(yīng)用場合。所以這種工藝將是今后一段時期單片機(jī)發(fā)展的主要途徑 </p><p><b>　　2.微型單片化 </b></p><p>　　現(xiàn)在常規(guī)的單片機(jī)普遍都是將中央處理器(CPU)、隨機(jī)存取數(shù)據(jù)存儲(RAM)、只讀程序存儲器(ROM)、并行和串行通信接口，中斷系統(tǒng)、定時電路、時鐘電路集成在一塊單一的芯片上，增強(qiáng)型的單片機(jī)集成了如A/D轉(zhuǎn)換器、PMW(脈寬調(diào)制電路)

11、、WDT(看門狗)、有些單片機(jī)將LCD(液晶)驅(qū)動電路都集成在單一的芯片上，這樣單片機(jī)包含的單元電路就更多，功能就越強(qiáng)大。甚至單片機(jī)廠商還可以根據(jù)用戶的要求量身定做，制造出具有自己特色的單片機(jī)芯片。 此外，現(xiàn)在的產(chǎn)品普遍要求體積小、重量輕，這就要求單片機(jī)除了功能強(qiáng)和功耗低外，還要求其體積要小?，F(xiàn)在的許多單片機(jī)都具有多種封裝形式，其中SMD(表面封裝)越來越受歡迎，使得由單片機(jī)構(gòu)成的系統(tǒng)正朝微型化方向發(fā)展。 </p><

12、;p>　　3.主流與多品種共存 　　</p><p>　　現(xiàn)在雖然單片機(jī)的品種繁多，各具特色，但仍以80C51為核心的單片機(jī)占主流，兼容其結(jié)構(gòu)和指令系統(tǒng)的有PHILIPS公司的產(chǎn)品，ATMEL公司的產(chǎn)品和中國臺灣的Winbond系列單片機(jī)。所以C8051為核心的單片機(jī)占據(jù)了半壁江山。而Microchip公司的PIC精簡指令集(RISC)也有著強(qiáng)勁的發(fā)展勢頭，中國臺灣的HOLTEK公司近年的單片機(jī)產(chǎn)量與日俱增

13、，與其低價質(zhì)優(yōu)的優(yōu)勢，占據(jù)一定的市場分額。此外還有MOTOROLA公司的產(chǎn)品，日本幾大公司的專用單片機(jī)。在一定的時期內(nèi)，這種情形將得以延續(xù)，將不存在某個單片機(jī)一統(tǒng)天下的壟斷局面，走的是依存互補(bǔ)，相輔相成、共同發(fā)展的道路。</p><p>　　三、數(shù)字單片機(jī)的技術(shù)發(fā)展</p><p>　　數(shù)字單片機(jī)的技術(shù)進(jìn)步反映在內(nèi)部結(jié)構(gòu)、功率消耗、外部電壓等級以及制造工藝上。在這幾方面，較為典型地說明了數(shù)

14、字單片機(jī)的水平。在目前，用戶對單片機(jī)的需要越來越多，但是，要求也越來越高。下面分別就這四個方面說明單片機(jī)的技術(shù)進(jìn)步狀況。 </p><p>　　1、內(nèi)部結(jié)構(gòu)的進(jìn)步 </p><p>　　單片機(jī)在內(nèi)部已集成了越來越多的部件，這些部件包括一般常用的電路，例如：定時器，比較器，A/D轉(zhuǎn)換器，D /A轉(zhuǎn)換器，串行通信接口，Watchdog電路，LCD控制器等。 有的單片機(jī)為了構(gòu)成控制網(wǎng)絡(luò)或形成局部

15、網(wǎng)，內(nèi)部含有局部網(wǎng)絡(luò)控制模塊CAN。例如，Infineon公司的C 505C，C515C，C167CR，C167CS-32FM，81C90；Motorola公司的68HC08AZ 系列等。特別是在單片機(jī)C167CS-32FM中，內(nèi)部還含有2個CAN。因此，這類單片機(jī)十分容易構(gòu)成網(wǎng)絡(luò)。特別是在控制，系統(tǒng)較為復(fù)雜時，構(gòu)成一個控制網(wǎng)絡(luò)十分有用。 為了能在變頻控制中方便使用單片機(jī)，形成最具經(jīng)濟(jì)效益的嵌入式控制系統(tǒng)。有的單片機(jī)內(nèi)部設(shè)置了專門用于變

16、頻控制的脈寬調(diào)制控制電路，這些單片機(jī)有Fujitsu公司的MB89850系列、MB89860系列；Motorola 公司的MC68HC08MR16、MR24等。在這些單片機(jī)中，脈寬調(diào)制電路有6個通道輸出，可產(chǎn)生三相脈寬調(diào)制交流電壓，并內(nèi)部含死區(qū)控制等功能。 特別引人注目的是：現(xiàn)在有的單片機(jī)已采用所謂的三核（TrCore）結(jié)構(gòu)。這是一種建立在系統(tǒng)級芯片</p><p>　　2、 功耗、封裝及電源電壓的進(jìn)步 <

17、;/p><p>　　現(xiàn)在新的單片機(jī)的功耗越來越小，特別是很多單片機(jī)都設(shè)置了多種工作方式，這些工作方式包括等待，暫停，睡眠，空閑，節(jié)電等工作方式。Philips公司的單片機(jī)P87LPC762是一個很典型的例子，在空閑時，其功耗為1.5 mA，而在節(jié)電方式中，其功耗只有0.5mA。而在功耗上最令人驚嘆的是TI公司的單片機(jī)MSP430系列，它是一個 16位的系列，有超低功耗工作方式。它的低功耗方式有LPM1、LPM3、LP

18、M4三種。當(dāng)電源為3V時，如果工作于 LMP1方式，即使外圍電路處于活動，由于CPU不活動，振蕩器處于1～4MHz，這時功耗只有50?A。在LPM3 時，振蕩器處于32kHz，這時功耗只有1.3?A。在LPM4時，CPU、外圍及振蕩器32kHz都不活動，則功耗只有0.1?A。 現(xiàn)在單片機(jī)的封裝水平已大大提高，隨著貼片工藝的出現(xiàn)，單片機(jī)也大量采用了各種合符貼片工藝的封裝方式出現(xiàn)，以大量減少體積。在這種形勢中，Microchip公司推出的8

19、引腳的單片機(jī)特別引人注目。這是PIC12CXXX系列。它含有0.5～2K程序存儲器，25～128字節(jié)數(shù)據(jù)存儲器，6個I/O端口以及一個定時器，有的還含4道A/D</p><p>　　3、 工藝上的進(jìn)步 </p><p>　　現(xiàn)在的單片機(jī)基本上采用CMOS技術(shù)，但已經(jīng)大多數(shù)采用了0.6?m以上的光刻工藝，有個別的公司，如Motorola公司則已采用0.35?m甚至是0.25?m技術(shù)。這些技術(shù)

20、的進(jìn)步大大地提高了單片機(jī)的內(nèi)部密度和可靠性。 </p><p>　　四、以單片機(jī)為核心的嵌入式系統(tǒng)</p><p>　　單片機(jī)的另外一個名稱就是嵌入式微控制器，原因在于它可以嵌入到任何微型或小型儀器或設(shè)備中。目前，把單片機(jī)嵌入式系統(tǒng)和Internet連接已是一種趨勢。但是，Internet一向是一種采用肥服務(wù)器，瘦用戶機(jī)的技術(shù)。這種技術(shù)在互聯(lián)上存儲及訪問大量數(shù)據(jù)是合適的，但對于控制嵌入式器

21、件就成了"殺雞用牛刀"了。要實現(xiàn)嵌入式設(shè)備和Int ernet連接，就需要把傳統(tǒng)的Internet理論和嵌入式設(shè)備的實踐都顛倒過來。為了使復(fù)雜的或簡單的嵌入式設(shè)備，例如單片機(jī)控制的機(jī)床、單片機(jī)控制的門鎖，能切實可行地和Internet連接，就要求專門為嵌入式微控制器設(shè)備設(shè)計網(wǎng)絡(luò)服務(wù)器，使嵌入式設(shè)備可以和Internet相連，并通過標(biāo)準(zhǔn)網(wǎng)絡(luò)瀏覽器進(jìn)行過程控制。 </p><p>　　目前，為了把

22、單片機(jī)為核心的嵌入式系統(tǒng)和Internet相連，已有多家公司在進(jìn)行這方面的較多研究。這方面較為典型的有emWare公司和TASKING公司。 EmWare公司提出嵌入式系統(tǒng)入網(wǎng)的方案--EMIT技術(shù)。這個技術(shù)包括三個主要部分：即emMicro， emGateway和網(wǎng)絡(luò)瀏覽器。其中，emMicro是嵌入設(shè)備中的一個只占內(nèi)存容量1K字節(jié)的極小的網(wǎng)絡(luò)服務(wù)器； emGateway作為一個功能較強(qiáng)的用戶或服務(wù)器，它用于實現(xiàn)對多個嵌入式設(shè)備的管理

23、，還有標(biāo)準(zhǔn)的Internet 通信接入以及網(wǎng)絡(luò)瀏覽器的支持。網(wǎng)絡(luò)瀏覽器使用emObjicts進(jìn)行顯示和嵌入式設(shè)備之間的數(shù)據(jù)傳輸。 如果嵌入式設(shè)備的資源足夠，則emMicro和emGateway可以同時裝入嵌入式設(shè)備中，實現(xiàn)Inter net的直接接入。否則，將要求emGateway和網(wǎng)絡(luò)瀏覽器相互配合。EmWare的EMIT軟件技術(shù)使用標(biāo)準(zhǔn)的 Internet協(xié)議對8位和16位嵌入式設(shè)備進(jìn)行管理，但比傳統(tǒng)上的開銷小得多。 目前，單片機(jī)應(yīng)

24、用中提出了一個新的問題：這就是如何使8位、16位單片機(jī)控制的產(chǎn)品，也即嵌入式產(chǎn)品或設(shè)備能實現(xiàn)和互聯(lián)網(wǎng)互連？ </p><p>　　五，單片機(jī)應(yīng)用的可靠性技術(shù)發(fā)展 </p><p>　　在單片機(jī)應(yīng)用中，可靠性是首要因素為了擴(kuò)大單片機(jī)的應(yīng)用范圍和領(lǐng)域，提高單片機(jī)自身的可靠性是一種有效方法。近年來，單片機(jī)的生產(chǎn)廠家在單片機(jī)設(shè)計上采用了各種提高可靠性的新技術(shù)，這些新技術(shù)表現(xiàn)在如下幾點： </

25、p><p>　　1、EFT（Ellectrical Fast Transient）技術(shù) </p><p>　　EFT技術(shù)是一種抗干擾技術(shù)，它是指在振蕩電路的正弦信號受到外界干擾時，其波形上會迭加各種毛刺信號，如果使用施密特電路對其整形，則毛刺會成為觸發(fā)信號干擾正常的時鐘，在交替使用施密特電路和RC濾波電路時，就可以消除這些毛否則令其作用失效，從而保證系統(tǒng)的時鐘信號正常工作。這樣，就提高了單片機(jī)

26、工作的可靠性。Motorola公司的 MC68HC08系列單片機(jī)就采用了這種技術(shù)。 低噪聲布線技術(shù)及驅(qū)動技術(shù) </p><p>　　在傳統(tǒng)的單片機(jī)中，電源及地線是在集成電路外殼的對稱引腳上，一般是在左上、右下或右上、左下的兩對對稱點上。這樣，就使電源噪聲穿過整塊芯片，對單片機(jī)的內(nèi)部電路造成干擾。現(xiàn)在，很多單片機(jī)都把地和電源引腳安排在兩條相鄰的引腳上。這樣，不僅降低了穿過整個芯片的電流，另外還在印制電路板上容易布置

27、去耦電容，從而降低系統(tǒng)的噪聲。 現(xiàn)在為了適應(yīng)各種應(yīng)用的需要，很多單片機(jī)的輸出能力都有了很大提高，Motorola公司的單片機(jī)I/O口的灌拉電流可達(dá)8mA以上，而Microchip公司的單片機(jī)可達(dá)25mA。其它公司：AMD，F(xiàn)ujitsu，NEC ，Infineon，Hitachi，Ateml，Tosbiba等基本上可達(dá)8～20mA的水平。這些電流較大的驅(qū)動電路集成到芯片內(nèi)部在工作時帶來了各種噪聲，為了減少這種影響，現(xiàn)在單片機(jī)采用多個小管

28、子并聯(lián)等效一個大管子的方法，并在每個小管子的輸出端串上不同等效阻值的電阻，以降低di/dt，這也就是所謂"跳變沿軟化技術(shù)"，從而消除大電流瞬變時產(chǎn)生的噪聲。 </p><p><b>　　2、采用低頻時鐘 </b></p><p>　　高頻外時鐘是噪聲源之一，不僅能對單片機(jī)應(yīng)用系統(tǒng)產(chǎn)生干擾，還會對外界電路產(chǎn)生干擾，令電磁兼容性不能滿足要求。對于要求

29、可靠性較高的系統(tǒng)，低頻外時鐘有利于降低系統(tǒng)的噪聲。在一些單片機(jī)中采用內(nèi)部瑣相環(huán)技術(shù)，則在外部時鐘較低時，也能產(chǎn)生較高的內(nèi)部總線速度，從而保證了速度又降低了噪聲。Motorola公司的MC68HC08系列及其1 6/32位單片機(jī)就采用了這種技術(shù)以提高可靠性</p><p>　　First, the development of simulator </p><p>　　Throughout

30、nearly two decades of national development process of simulation technology, according to simulator technology to be used to divide the domestic about the design of simulators can be divided into the following periods: &

31、lt;/p><p>　　(1) the late 70s in the mid -80 </p><p>　　The technology during this period was mainly the development of simulation systems, now is not high technology, the user request is not high. &

32、lt;/p><p>　　(2) the late 80's during the late -90 </p><p>　　The main use of this period with an emulation function Winbond chip production, the technology is called Bondout. Using this chip to

33、greatly simplify the design of emulator, so the standard of domestic emulator with a large increase can be largely occupied by the user resources. </p><p>　　Simulation performance is due to the increase in d

34、omestic production in the emulator nearly 10 years no progress has been produced using this model. Although individual companies have also tried other techniques to improve the simulation of the standard, for example, HO

35、OKS technology, but because of their technical limitations did not succeed. Instead abroad earlier simulator technology used HOOKS, HOOKS at the initial stage due to the complexity of the technology itself, simulation pe

36、rformance </p><p>　　With the development of IC technology, the domestic production HOOKS technology is ripe, but several major domestic manufacturers also Bondout technologies intoxicated. </p><p&

37、gt;　　(3)After 2000 year </p><p>　　China in 2000 emulator period changes in the market, the largest, the most striking change is the Winbond W78958 chip simulation of the production. </p><p>　　

38、Winbond W78958 chip during the design stage, the internal functions of the simulation only to the production simulator to simulator manufacturers in order to better promote the W78958. After several years of change, howe

39、ver, W78958 simulator evolved into the use of a simulation of the ASIC rather than using the standard chip, the scope of use is limited to domestic and 20,000 a year less than the amount the company also contributed to t

40、he Winbond After entering in 2002 announced that it would st</p><p>　　W78958 production, the domestic manufacturers simulator in a very embarrassing situation. W78958 use at home as a result of nearly 10 yea

41、rs, the domestic user base is very large, these users will not be able to receive continued support, especially maintenance. In addition, the domestic focus in the W78958 on the technical work done can not be renewed and

42、 improved, many people in the industry that the industry will face a simulator to set up or re-shuffle of the situation. </p><p>　　HOOKS simulator technology is no doubt W78958 manufacturers after the loss o

43、f alternatives, but the absence of long-term follow-up and attention, not the short term the majority of manufacturers of complex HOOKS mature technology products. Experts believe that the overall simulator manufacturers

44、 in transition may need 2-3 years of the cycle, and there is considerable simulator manufacturers will be eliminated, the market will have mainly concentrated in a few simulator manufacturers. </p><p>　　Chip

45、 manufacturers as more and more resources getting stronger and stronger, with chip to chip compatible simulation simulation model, there is incomplete coverage of resources (such as additional ports, additional external

46、interrupt), address different distribution (such as the P4 I ), to operate in different ways (such as EXTRAM, WTD) and other shortcomings. Simulation with a dedicated chip to chip or Philips simulation of more than 20 ma

47、nufacturers more than 400 kinds of chips, the first simu</p><p>　　But a new generation of patented technology makes the simulator there is no economic power can not afford to buy the beginners. </p>&

48、lt;p>　　Second, the development trend of single-chip </p><p>　　It can be said now is a single-chip opinions of the period, the world's major chip manufacturing companies have introduced their own singl

49、e-chip, from the 8, 16-32, just to name a few, everything, it is compatible with mainstream C51 series of , there are not compatible, but they own each other into each other, for SCM applications world wide. </p>

50、<p>　　Throughout the development process of single-chip, you can indicate the development trend of single-chip, generally are: </p><p>　　1. Low-power CMOS technology </p><p>　　MCS-51 series

51、 of 8031 introduced the power consumption of 630mW, and now widespread in the single-chip 100mW or so, with the growing demand for low-power single-chip, and now all the basic single-chip manufacturers are use of CMOS (c

52、omplementary metal oxide semiconductor process). As the 80C51 on the use of HMOS (high density metal oxide semiconductor process) and CHMOS (high-density complementary metal oxide semiconductor process). Although the CMO

53、S low power consumption, but because of its phy</p><p>　　2. Of micro-chip </p><p>　　Now are generally in conventional single-chip will be the central processing unit (CPU), random access data st

54、orage (RAM), read-only program memory (ROM), parallel and serial communication interface, system interruption, timing circuits, integrated circuit clock in a single chip, enhanced single-chip integration, such as A / D c

55、onverter, PMW (pulse width modulation circuit), WDT (watchdog), and some will be single-chip LCD (LCD) driver integrated circuits are in a single chip, this unit includes</p><p>　　3. The mainstream and multi

56、-species coexistence </p><p>　　Although a wide variety of single-chip, unique, but still single-chip microcomputer 80C51 prevailing at the core, compatible with its structure and command system of PHILIPS pr

57、oducts, ATMEL company's products and China Taiwan's Winbond Series Single machine. Therefore, single-chip microcomputer as the core C8051 occupied the half. Microchip's PIC and reduced instruction set (RISC)

58、has a strong development momentum of China Taiwan HOLTEK single-chip companies in recent years, increasing productio</p><p>　　Third, the technical development of digital single-chip </p><p>　　Th

59、e number of single-chip technology is reflected in the internal structure, power consumption, as well as the external voltage level on the manufacturing process. In these areas, more typically describes the number of sin

60、gle-chip level. At the moment, users need more and more single-chip, but getting higher and higher requirements. The following four areas on which the technological progress that the situation of single-chip microcompute

61、r. </p><p>　　1, the internal structure of the progress </p><p>　　Single-chip integrated in-house has been an increasing number of parts, these parts include commonly used circuits, such as: time

62、rs, comparators, A / D converter, D / A converters, serial communication interface, Watchdog circuit , LCD controller. Some single-chip control network in order to constitute or form a local network, the internal local a

63、rea network control module contains the CAN. For example, Infineon's C 505C, C515C, C167CR, C167CS-32FM, 81C90; Motorola's 68HC08AZ series. Especially </p><p>　　Of particular note are: It is now some

64、 have adopted the so-called single-chip trinuclear (TrCore) structure. This is a system-level chips built on the (System on a chip) on the structure of the concept. This single-chip consists of three core components: a m

65、icro-controller and the DSP core, a data and program memory is nuclear and the last one is the external application specific integrated circuit (ASIC). The most important feature of this single-chip is the DSP and microc

66、ontroller at the same </p><p>　　2, power consumption, packaging and power supply voltage of the progress </p><p>　　Now the new single-chip power consumption is getting smaller and smaller, espec

67、ially the many single-chip are a variety of work settings, which include waiting, suspended, sleep, idle, power-saving mode and so on. P87LPC762 single-chip company Philips is a very typical example, in idle, the power c

68、onsumption is 1.5 mA, while in power-saving mode, the power consumption is only 0.5mA. In the most amazing power is TI's MSP430 family of single chip, it is a series of 16, there are ultra-low power wo</p><

69、;p>　　3, the progress of technology </p><p>　　Basically, the current single-chip CMOS technology used, but most use 0.6? M above the lithography process, there are individual companies such as Motorola Inc

70、. have been using 0.35? M or even 0.25? M technology. These technological advances greatly improved the internal single-chip density and reliability. </p><p>　　Fourth, embedded system as the core of a single

71、-chip </p><p>　　SCM is a new name embedded micro-controller, because it can be embedded into any micro-or small-scale equipment or equipment. At present, the single-chip embedded systems and Internet connect

72、ivity is a trend. However, Internet has been used as a fat server, thin machine technology users. This technology on the Internet to store and access large amounts of data is appropriate, but for control of embedded devi

73、ces has become the "sledgehammer cracking a nut," the. Embedded devices to achieve and In</p><p>　　At present, in order to single-chip microcomputer as the core of embedded systems and Internet con

74、nected companies, there are many more studies in this area. More typical in this regard have emWare and TASKING company. Embedded systems companies EmWare network program - EMIT technology. This technology consists of th

75、ree main parts: the emMicro, emGateway and web browser. Which, emMicro embedded devices is a 1K-byte memory capacity accounted for only a very small web servers; emGateway stronger a</p><p>　　Fifth, technolo

76、gy development of the reliability of single-chip application </p><p>　　In single-chip applications, reliability is the primary factor in the application of SCM in order to expand the scope and areas to impro

77、ve the reliability of its single-chip is an effective method. In recent years, manufacturers of single-chip single-chip design in the use of a variety of new technologies to improve reliability, the performance of these

78、new technologies in the following points: </p><p>　　1, EFT (Ellectrical Fast Transient) technology </p><p>　　2, EFT is an anti-jamming technology, which is defined as the sinusoidal signal oscil

79、lation circuit outside interference, the waveform will be a variety of Deburring signal superposition, if you use their plastic Schmidt circuit, it will become a burr trigger signals interfere with the normal clock, in t

80、he alternate use of Schmitt circuit and RC filter circuit, it can be eliminated or their role in these gross failure to ensure that the clock signal systems work properly. In this way, a single c</p><p>　　In

81、 a traditional single-chip, the power and ground wire in the integrated circuit pin symmetric shell, the general is in the upper left, lower right or upper right, lower left of the two pairs of symmetric points. In this

82、way, so that power supply noise on the chip through the block of single-chip interference caused by the internal circuit. Now, put a lot of single-chip power pin arrangement and the two adjacent pins. In this way, not on

83、ly reduces the current through the entire chip, while stil</p><p>　　3, the use of low-frequency clock </p><p>　　High-frequency noise sources outside the clock is one, not only can interfere with

84、 single-chip applications, but also interfere with the outside circuit, so that can not meet the requirements of electromagnetic compatibility. Requirements for high reliability systems, low-frequency external clock to r