smt整個(gè)工藝流程細(xì)講

1、SMT整個(gè)工藝流程細(xì)講整個(gè)工藝流程細(xì)講一、SMT工藝流程簡(jiǎn)介..........................................................................................................4二、焊接材料.............................................................................

2、...............................................6錫膏............................................................................................................................................6錫膏檢驗(yàn)項(xiàng)目.......................

3、.............................................................................................9錫膏保存，使用及環(huán)境要求............................................................................................9助焊劑（FLUX）............

4、.........................................................................................................9焊錫：...............................................................................................................

5、.......................11紅膠..........................................................................................................................................11洗板水..................................................

6、....................................................................................12三、鋼網(wǎng)印刷制程規(guī)范..........................................................................................................13錫膏印刷機(jī)（絲印機(jī)）......

7、....................................................................................................13SMT半自動(dòng)印刷機(jī)(PT250)作業(yè)規(guī)范..........................................................................13刮刀(squeegee)..........

8、......................................................................................................14真空支座................................................................................................................

9、..........14影響因素..................................................................................................................................151鋼網(wǎng)PCB精確對(duì)位：.............................................................

10、.................................152、消除鋼網(wǎng)支撐架的厚度誤差：................................................................................153、消除PCB的翹曲：.............................................................................

11、.....................164、印刷時(shí)刮刀的速度：..............................................................................................165、刮刀壓力：...................................................................................

12、...........................166、鋼網(wǎng)PCB分離：......................................................................................................167、鋼網(wǎng)清洗：......................................................................

13、........................................178、印刷方向：................................................................................................................179、溫度：....................................................

14、....................................................................1710、焊膏圖形的印刷后檢測(cè)：......................................................................................17焊膏圖形的缺陷類型及產(chǎn)生原因..................................

15、........................................................18鋼網(wǎng)stencils.............................................................................................................................19自動(dòng)光學(xué)檢測(cè)(AOI)..............

16、..................................................................................................21四、貼片制程規(guī)定................................................................................................................

17、..23貼片機(jī)簡(jiǎn)介..............................................................................................................................23YAMAHA貼片機(jī)YV100X....................................................................

18、...............................25使用條件和參數(shù)..............................................................................................................25各部件的名稱及功能...........................................................

19、...........................................26供料器feeder...........................................................................................................................29盤裝供料器....................................

20、..................................................................................29托盤供料器......................................................................................................................31管裝供料器......

21、................................................................................................................31排除流程圖（元件不能被拾取產(chǎn)生拾取故障時(shí)）......................................................32貼片機(jī)YV100X的基本操作...............

22、..................................................................................321、日常生產(chǎn)基本操作（集中在running菜單中）.....................................................324、PCB生產(chǎn)開(kāi)始...............................................

23、............................................................338豎碑（Tombstoning）.................................................................................................659、BGA成球不良..................................

24、......................................................................6610形成孔隙.....................................................................................................................66六、手工焊接制程以及手工標(biāo)準(zhǔn).........

25、.................................................................................674.1焊接操作的正確姿勢(shì)........................................................................................................684.2焊接操作的基本步驟.......

26、.................................................................................................684.3焊接溫度與加熱時(shí)間........................................................................................................694.4

27、焊接操作的具體手法........................................................................................................694.5焊點(diǎn)質(zhì)量及檢查...............................................................................................

28、.................70手工烙鐵焊接技術(shù)..................................................................................................................744.3焊接溫度與加熱時(shí)間.................................................................

29、..............................754.4焊接操作的具體手法...............................................................................................754.5焊點(diǎn)質(zhì)量及檢查.....................................................................

30、..................................76五靜電簡(jiǎn)介..................................................................................................................79七、波峰焊機(jī).........................................................

31、.................................................................81波峰焊機(jī)組件日常維護(hù)要點(diǎn)..........................................................................................82八、其他SMT設(shè)備........................................

32、.......................................................................84空壓機(jī)......................................................................................................................................84空氣壓縮機(jī)操作指

33、導(dǎo)......................................................................................................84螺桿式空氣壓縮機(jī)SA350W操作指導(dǎo).......................................................................84冷凍式干燥機(jī)..................

34、........................................................................................................85冷凍式干燥機(jī)GC75GC30GC10操作指導(dǎo)...........................................................85水洗機(jī)............................

35、..........................................................................................................85九、運(yùn)輸、儲(chǔ)存和生產(chǎn)環(huán)境..................................................................................................86

36、十、料件的基本知識(shí)..............................................................................................................90PCB（PrintedCircuitBoard）即印刷電路板.....................................................................

37、.....902.2元件基本知識(shí)...................................................................................................................912.2.1電阻器...............................................................................

38、......................................912.2.2電容器....................................................................................................................912.2.3表貼阻容元件的封裝代號(hào)......................................

39、........................................922.2.4二極管....................................................................................................................932.2.5存儲(chǔ)器............................................

40、.........................................................................932.2.6芯片：.....................................................................................................................942.2.7BGA封裝........

41、................................................................................................942.3SMD元件的包裝形式：........................................................................................952.4PCB及IC的方向......

42、.......................................................................................................95十一、如何讀懂BOM.......................................................................................................98

43、貼片機(jī)料件知識(shí)..............................................................................................................99十二、SMT設(shè)計(jì)（可生產(chǎn)性）......................................................................................1