銅線鍵合優(yōu)勢(shì)和工藝的優(yōu)化.pdf

1、蘇州大學(xué)碩士學(xué)位論文銅線鍵合優(yōu)勢(shì)和工藝的優(yōu)化姓名：韓幸倩申請(qǐng)學(xué)位級(jí)別：碩士專(zhuān)業(yè)：集成電路指導(dǎo)教師：黃秋萍201110TheAdvantageandProcessOptimizationforCopperWireBondAbstractRegardingthechip，itisnotonlynecessarybutalsoamustItcallalsobesaidthatthesealreferstotheothercasingwhich

2、theinstalledsemiconductorintegratedcircuitusesItnotonlyimprovestheprotectionofthechipandenhancedheattransmissionperformancebutalsolinksthechipsinteriorandexteriorelectricbridgecircuitstandardfunctionsTheleadwireboIldthat

3、holdsthepivotalstatusinthesemiconductorsealfillsanimportantandcomplexassemblyoperationChapterIintroducestheroleandcharacteristicsofthesemiconductorpackage；ChapterIIoutlinessemiconductormanufacturingprocess；ChapterIIIdesc

4、ribesthepositionandcharacteristicsofwirebondingprocess；ChapterIVexpoundstheadvantageofthereplacementofthegoldenwirebycopperwire，includethelowcostresistanceandIMCgrowth，enhancedmechanicalproperties，betterthermalproperties

5、；ChapterVsumnlariesthechallengeofcopperwireeasyoxidationhardness，easytohavecrackindielectricandSOon；ChapterVIputsforwardtheprocessoptimizationinthepracticalapplicationsuchasequipmentforantioxidizationtheparameteroptimiza

6、tionforcopperwirecapillarypressandultrasonic，bondpadcompositionandthickness，machinetemperaturecontrolandSOonChapterVIIstudiesthecommonproblemswhichwouldbeencounteredinproductionandproposetherelatedsolutions；ChapterVIIIan