深亞微米光阻殘留顆粒的研究.pdf

1、目錄摘要..........................................................................................................……，........……1Abstract.……，....................................................................................

2、.......................……2第一章緒論..……，..............................................……，.............................................……31.1中國半導體的發(fā)展............................................................................

3、.......……31.2激烈競爭的IC制造業(yè).........................……，.............................................……41.3良率...........................................................................................................……41.4晶圓表

4、面污染物的分類與濕法清洗簡介...............................................……51.5課題的提出..............................……，...........……，...............……，.……，........……，.6第二章深亞微米顆粒在多晶硅柵工藝中的危害二，.........................……，............……72

5、.1深亞微米污染物導致的產品問題....................................................……，……72.2對于缺陷性質與影響的分析...................................................................……82.3深亞微米表面污染物的來源.............................……，..............

6、.................……92.4本章小結.................................................................……，.........................……H第三章深亞微米污染物的產生和分析........……，............................................……123.1間接觀測深亞微米污染物的方法..……，

7、................................................……123.2間接觀測法的應用實驗.........................................................................……143.3SPM槽污染物的來源.…__....……_二，_二，.甲.……，.…_，_._.........……_.....……，......……巧3.4本章小結

8、二，............................................................……_......................……，.…17第四章深亞微米污染物去除工藝的優(yōu)化........................................................……184.1污染物的微觀分類...……，................................

9、......................................……184.2污染物的去除機理以及影響因素........................................................……184.3SCI清洗與兆聲波技術.……，....................……，....................................……，二204.4優(yōu)化濕法光阻剝離后的清洗工藝.

10、.....................................……，...........……234.5木章小結....……，..................................................……，.......……，..............……25第五章深亞微米污染物的監(jiān)控方法.......................................................

11、.........……265.1放大檢測法的應用實驗..............................……，................................……265.2SPM藥液的使用時間與檢測結果的關系...........................................……275.3檢測工藝過程中的系統(tǒng)誤差..…，....……_.................……，...........

12、..……，...……285.4如何回收利用檢測控片……，....................................……，....................……295.5本章小結....................................................……，....................……_…，..……_.…30第六章總結與展望_...……，..................

13、....……，.............……，.……，........................……316.1深亞微米顆粒研究結果總結.................……‘..........……，......................……316.2清洗技術發(fā)展趨勢展望............................……_.....................................……32參考文獻..

14、..............................................................................……，.......................……34致謝..............................................................……，....……，..…，....................……，.....……36Ab

15、straCtAsthegeometryoftheICdevices15getingsmallerandsmaller，themanufaettlreteehniquesmustbecontinuouslyoPtintized.For0.13件mlogicProeess，afterPhotesistarieestriPProcessbefePolyeteh，someverysmallPartieleslessthan0.1件mwhiehe

16、annotbedeteetedbythemeasurementtoolarefound.It15revealedthatthesetinydefeetswilleausePolyresidueissueandlowyieldissue.ToobservethesetinyPaltieles，anindirectmeasurementmethodinWhiehthetinyPaltieleswillbema加fiedbyPolyDEP15

17、ProPosed.Withthisnewmethod，theeontaminatedSPMbathwasfoundandtheeontajminationsouree15eonfirnledasAA一ETProcessduetoitsPolymerresidualsafterdryeteh.TWooPtimizedProeessesaresuggested:1)APPlyingmega一soniefunetioninSCIeleanaf

18、terPR一striPeanimProvetinyPartielesremovalrate，andthePoly一51filmwillnotbedamagedbyhighenergymega一sonie:2)SeParatingAA一ETProcessfromthekeyfilmeleanProeesstoavoiderosseontamination.ThistwooPtimizesolutionseanProvidesteadywe