微波多芯片組件互連結(jié)構(gòu)電磁兼容性研究.pdf

1、電子科技大學(xué)碩士學(xué)位論文微波多芯片組件互連結(jié)構(gòu)電磁兼容性研究姓名：朱琳申請(qǐng)學(xué)位級(jí)別：碩士專業(yè)：等離子體物理指導(dǎo)教師：謝擴(kuò)軍20070601ABSTRACTTheworkinthispaperisfocusedontheproblemofElectromagneticInterference(EMI)routeanditseffect(interconnection，coupling)onMMCMAthreedimensional(3D)

2、microwavetransmissionstructurewasstudiedinthispaperItincludesworksfor：establishingtheforecastingEMImodel，extractingtheelectromagneticparametersoftheinterconnectionstructureandthecouplingstructurebasedontheanalysisofEMIro

3、uteoftheforecastingEMImodelMainstudycontainsthefollowing：1Acoupledmodelwhichcontainsagroupof10mmlongparallelmicrostripsisusedtobeanalysisandcomputeitsscatteringparameterandcouplingcoe伍cientSomelawsofcouplingcoefficientin

4、themodelareshownwhiletoChaJlgetheintervalbetweenthelines，itisshownfromresultofsimulationexperimentthatthebiggerthemicrostrips’intervalis，thelessofitscouplingcoefncientSomewaysofdecreaseinterferenceandvalidatedthemisbroug

5、htforwardbasedontheanalysisofthenumericalresultobtainedthroughsimulationpreceding2TheobjecttosimulateisthesignalviamodelofMMCM，equaldistanceandsymmetricaddingcoaxiallyshieldingviaaroundsignalviaIftwoverticalsignalvias，di

6、stanceistoosmall，thecouplingofthemwillbeincreasedevidently，byaddingshieldingviabetweenthem，thecouplingcoefficientoftheverticaIsignalviacanbedecreasedWiththesimulationofsignalviascatteringparameter，conclusionthatshielding

7、viaCallimprovethescatteringparameterofsignalviaConsideringthatthereexistssynchronouslyeoaxiallyshieldingVia，simulatingresultshowsthattoaddalayerofdielectricbetweenmicrostripandstriplinecallimproveevidentlythescatteringpa

8、rameterofsignalviaButifaddingprogressivelyshieldingvia，itsscatteringparameterwillbc4comeworseIftwoverticalsignalviadistanceistoosmall，thecouplingofthemwillbeincreasedevidently，byaddingshieldingviabetweenthem，thecouplingⅡ