超高純al0.5％cu合金軋制與退火過(guò)程中微觀組織與織構(gòu)的研究

1、重慶大學(xué)碩士學(xué)位論文超高純Al-0.5%Cu合金軋制與退火過(guò)程中微觀組織與織構(gòu)的研究姓名：陳江波申請(qǐng)學(xué)位級(jí)別：碩士專業(yè)：材料加工工程指導(dǎo)教師：黃光杰2010-05英文摘要 IIIABSTRACT As a new electronic materials, the ultra- high purity Al- 0.5%Cu alloy target has been more and more widely

2、 used in the electronic filed. To improve quality of sputtering target, evolution of microstructure and texture must be done deeply. The evolution of microstructure and texture of high purity

3、Al- 0.5%Cu alloy were investigated through ptical microscopy (OM), electron back- scatter diffraction technology (EBSD), electron channeling contrast (ECC) combining with micro- hardness, X - ray, differential scann

4、ing calorimetry (DSC). Evolution of textures, Mechanical properties, and active energy during recrystallization processing was also studied. The results show that ultra- high purity Al- 0.5%Cu alloy

5、 target experienced strong dynamic recovery when multi- oriented rolled to large strain. Compared with the unidirectional rolling, stronger fibre texture was observed during clock cold rolling. The r

6、ecrystallization activation energy of the alloy sheet is 170.68 KJ/mol and 146.25 KJ/mol with 70% and 85% reduction respectively. The orientation of {100} texture density in both alloy targets incre

7、ased gradually with increasing anneal temperature and time during low temperature annealing. Higher {100} texture density was eraier to get with short- time at high- temperature. Simultaneously, the d

8、eformation texture is retained after recrystallization annealing for clock cold rolling, which is different from undirection rolling. S，Cube，orientation grains inclines to nucleate and grow more eaie

9、r during low temperature annealing, With increasing annealing time and temperature, grains with high active energy will grow also. The grow speed of grains shows no big difference owing to wea