表面組裝用無鉛焊膏的研究與評價.pdf

1、北京工業(yè)大學碩士學位論文表面組裝用無鉛焊膏的研究與評價姓名：周永馨申請學位級別：碩士專業(yè)：材料加工工程指導教師：雷永平20090501ABSTRACTABSTRACTWiththedevelopmentofelectronicindustryandsurfacemounttechnology(SMT)，solderpastehasbecomeoneofthemostimportantelectronicjoiningmaterialsi

2、nelectronic—industryT11ispaperanalyzedthepropertiesoftheSYS305lead—freesolderpasteandfluxAnewtypefluxhasbeendevelopedbyadjustingtheelementsofflux，theproportionofsolderpowerandthereliabilityofresiduesThesolderballtest’wet

3、tabilitytestandslumptesthavebeencarriedonTheresultsshowthat：1Theoriginalsolderpastecouldformweldingspots，butthespotshavebeenoxidizedseriouslytheresiduesafterweldingcannotbecurdled，andsurfaceinsulationresistanceWastoolowT

4、hereasonisthattheratioofactivatorisunreasonable，thesolvent’Smeltingpointisexcessivelylowtherosincontentisexcessivelyhigllintheoriginalflux2Throughchangingtheratioofactivatorthecorrosionoffluxhasbeenreduced；Goodsolventcom

5、ponentsystemswhichcallimprovetheflux’SwettabilityincreaceitssurfaceinsulationresistanceandhigherdissolvingabilitywasbroughoutChoosingnewratioofrosincomponentstodecreasethesolidcontent，enhancetheviscosityoffluxandmakether

6、esiduessolidification3Accodingtothenewfluxsystem，whenthesolderpowerWasaccountfor880％ofthesolderpaste，itcanbebetterprintedthantheotheronesTheinfluenceofthesolderpower’sproportiontorheologicalpropertiesandprintcapabilityha

7、sbeenstudied4Throughassessingthestandardofsolderpaste，thesolderballtestandthewettabilitytesthavereachedthefirstgrade；theslumprateisO10；theweldingspotshavegoodappearance；theresiduessolidifywellKeywordssolderpaste；flux；sol